Grand Venture Technology, A*Star to develop manufacturing platform for advanced ceramics
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Grand Venture Technology said the tie-up with A*Star will help it snag opportunities in high-growth industries.
PHOTO: THE BUSINESS TIMES
Chong Xin Wei
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SINGAPORE – Grand Venture Technology (GVT) and A*Star will be working together to develop a customised manufacturing platform for advanced ceramics.
GVT on Jan 13 said the tie-up will enable the precision engineering company to capture opportunities in high-growth industries such as semiconductors and strengthen its competitive edge.
It added: “This will enable GVT to address increasing demand from both existing and new customers, aligning with its broader strategy to deliver value through technological excellence and operational agility.”
The partnership is also expected to expand GVT’s differentiated capabilities in high-value ceramics manufacturing, as well as contribute to the company’s advanced materials research and development road map.
The development of the platform will be led by A*Star’s Singapore Institute of Manufacturing Technology.
More details about the tie-up will be announced at a later date, said GVT.
In December 2024, GVT was selected as a preferred supplier for advanced semiconductor packaging equipment by a global semiconductor assembly and packaging equipment manufacturer. This includes precision parts and components for thermal compression bonding equipment.
Thermal compression bonding is an important semiconductor process in assembling 2.5-dimensional and three-dimensional integrated circuits, flip-chip interconnections and chiplet architectures.
It is used in advanced semiconductor chips that support applications, such as those in data centres and artificial intelligence.
The process has become more important in ensuring smaller and more compact devices, faster performance and greater durability, amid growing demand for more power-efficient devices, said GVT.
The company is also positive on the growth of the advanced packaging market. Citing Yole Intelligence, the market is expected to grow at a compound annual growth rate of 11 per cent to reach US$69.5 billion (S$95.4 billion) in 2029.
In its business update for the nine months ended September 2024, GVT said that net profit after tax surged 33.5 per cent to $6.3 million, from $4.7 million in the previous corresponding period.
Revenue was up 35.8 per cent on the year to $111.9 million, largely driven by contributions from the company’s semiconductor segment.
The semiconductor segment posted a 50.8 per cent year-on-year increase in its revenue to $59.5 million in the recorded period. This came as GVT won new programmes and grew its wallet share.
GVT believes its semiconductor segment will continue to do well as the industry undergoes “significant structural transformation”, with advanced packaging playing a “pivotal role” in meeting the growing demands of emerging tech.
The group noted that it expects to meet the higher end of its target revenue guidance of between $80 million and $86 million for the second half of its 2024 fiscal year.
Shares of GVT closed down 2.39 per cent at 81.5 cents on Jan 13. THE BUSINESS TIMES
