WASHINGTON – The Biden administration unveiled tight restrictions on new operations in China by chipmakers that receive federal funds to build in the United States, potentially hampering efforts to expand in the world’s largest semiconductor arena.

The US$50 billion (S$67.2 billion) Chips and Science Act will now bar companies that win grants from expanding their output by 5 per cent for advanced chips and 10 per cent for older technology.

The US Department of Commerce also outlined other measures, including a US$100,000 spending cap on investments in advanced capacity in China.

Those so-called guardrails are part of Washington’s efforts to thwart Beijing’s ambitions while securing supply of the components that underpin revolutionary technologies, including artificial intelligence and supercomputers, as well as everyday electronics.

In past years, the US has blacklisted Chinese technology champions, sought to cut off the flow of sophisticated processors and banned its citizens from providing certain help to China’s chip industry.

The new restrictions tied to the Chips Act aim to impose more onerous limitations on companies expected to secure incentives, including industry leaders Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Intel, which all operate in China.

The restrictions could hamper longer-term efforts to chase growth in the world’s No. 2 economy, while also making it hard for Beijing to build up cutting-edge capabilities at home.

Intel shares fell 2.4 per cent in New York. At market close on Wednesday, Samsung Electronics shares were up 1.33 per cent while SK Hynix was up 3.95 per cent.

“Chips for America is fundamentally a national security initiative and these guardrails will help ensure malign actors do not have access to the cutting-edge technology that can be used against America and our allies,” Commerce Secretary Gina Raimondo said in a statement.

“We will also continue coordinating with our allies and partners to ensure this programme advances our shared goals, strengthens global supply chains and enhances our collective security.”

To ensure federal funding beneficiaries cannot meaningfully expand advanced production capacity in what the law terms “countries of concern”, which include China and Russia, the new rules will ban those companies from spending more than US$100,000 when adding capacity for logic chips more sophisticated than 28 nanometres (nm).

They also cannot add more than 5 per cent to the existing capacity of any single plant making these semiconductors in China.

While the proposed rule limits manufacturing expansion, grant recipients can still make technology upgrades to existing facilities to produce more advanced semiconductors, if the companies receive any necessary export control licences from the Commerce Department for doing so, an official familiar with the rule said.

For example, a recipient upgrading the technological capability of a facility can include making logic chips at a smaller node size or memory chips with more layers.

Typically, a smaller number in nanometres indicates a more advanced generation of logic chip, which processes information or handles tasks. Limits on the advanced capacity investments will be in place for 10 years. 

A single advanced chipmaking machine from a supplier like ASML Holding, Applied Materials or Tokyo Electron can cost tens of millions of dollars. 

Grant recipients also are not allowed to increase capacity by more than 10 per cent at their existing facilities in “countries of concern” for logic chips that are 28nm or less advanced, which the law defines as legacy semiconductors.

If they want to build new factories for this type of chip, at least 85 per cent of the output must be consumed by the host country and the companies must notify the Commerce Department.

While 28nm chips are several generations behind the most cutting-edge semiconductors available, they are used in a wide range of products, including cars and smartphones.

The US can claw back the full amount of federal grants if a recipient violates the rules, the Commerce Department has said.

The federal government can also claw back tax credits completely if companies materially increase semiconductor production capacity in a foreign country of concern within 10 years of winning the incentives, according to a separate statement from the Treasury Department.

The credit is generally equal to 25 per cent of qualified investments in a facility for making semiconductors or producing chip production machines in the US.

The new restrictions will make it even more challenging for TSMC to expand its most-advanced Chinese plant in the eastern city of Nanjing, where it is manufacturing 28nm and more advanced 16nm chips.

In October, chief executive C. C. Wei said TSMC was granted a one-year licence from the US government to grow production in China, temporarily exempting it from sweeping export control measures rolled out that month.

The US office responsible for implementing the Chips Act will send officials to South Korea, Japan and Taiwan starting Tuesday, Taiwan’s official Central News Agency reported.

TSMC spokesman Nina Kao declined to comment on the new restrictions. 

Samsung said it has been in close discussions with the US and South Korean governments, and it plans to determine its next step after reviewing the changes when they are announced.

South Korea’s Hynix, which makes memory chips in China, also said it will closely review the announcement.

Intel did not immediately respond to a request seeking comments.

Memory chipmakers such as Samsung will see tighter restrictions on their expansions in China as the Commerce Department will align the new guardrails with prohibited technology thresholds released in October.

The South Korean company runs a major site in the central city of Xi’an making Nand flash memory.

Intel has an “assemble and test” chip facility in the central city of Chengdu, a modest operation compared with the others.

The US also classified a list of semiconductors as critical to national security, making them subject to stricter controls than other legacy chips.

Those include compound semiconductors – an area of focus for the Chinese government in past years – chips designed for quantum information systems, specialised military capabilities and use in radiation-intensive environments.

Federal grant recipients will also be prohibited from engaging in joint research with, or licensing technology to, a foreign entity of concern.

That will cover any research and development done by two or more people. Licensing will be defined as an agreement to make patents, trade secrets or know-how available to another party. 

The list of foreign entities of concern will be broadened to include names on the Commerce Department’s entity list, the Treasury Department’s list of Chinese military companies and the Federal Communications Commission’s list of equipment and services posing national security risks.

That encompasses a host of China’s largest tech companies, including Huawei Technologies, artificial intelligence giant SenseTime Group and chip leaders such as Yangtze Memory Technologies.

The proposed rules will allow for 60 days of public comment before finalised regulations are published later in 2023. BLOOMBERG