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US chip gear giant Applied Materials to double S’pore manufacturing, R&D and headcount
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Applied Materials CEO Gary Dickerson said the company will have to collaborate with more partners to speed up innovation in packing technologies.
ST PHOTO: DESMOND WEE
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SINGAPORE - Applied Materials (AM), one of the world’s top suppliers of machines that make semiconductors, plans to double its Singapore manufacturing capacity, headcount and research activities in the coming years.
The US company will soon announce the expansion of one of its innovation centres here that focuses on advanced packaging of semiconductors – the integration of a multitude of components into a single package to enhance performance and power efficiency without a significant increase in the size and cost of the product.
