Sembcorp Industries issues S$200 million bonds at 3.7%

SINGAPORE - Sembcorp Industries is issuing bonds worth S$200 million to lenders at a 3.7 per cent yield, the company announced on Monday (June 19).

The bonds are due in June 2020. The settlement date of issue is June 22, the company said in a release.

The net proceeds will be used to refinance existing debts or perpetual securities and/or to finance working capital requirements of Sembcorp Industries and its subsidiaries.